Cooling a target using electrons

ABSTRACT

In an embodiment, a method includes, impinging a plurality of particles on a target such that electrons are emitted from the target and transporting the electrons from the target to a heat sink through a transporting medium. The target and the heat sink may be separated by a distance. The method further includes cooling the electrons using the heat sink and returning the electrons from the heat sink to the target.

RELATED APPLICATION

This application is a divisional of U.S. application Ser. No. 14/731,688filed Jun. 5, 2015 entitled “COOLING A TARGET USING ELECTRONS” whichclaims benefit under 35 U.S.C. § 119(e) to U.S. Provisional ApplicationNo. 62/011,994 entitled “SYSTEM AND METHOD FOR COOLING A TARGET,” filedJun. 13, 2014, the entire content of which is incorporated herein byreference.

TECHNICAL FIELD

This invention relates generally to thermodynamics, and moreparticularly to cooling a target using electrons.

BACKGROUND

Certain applications may include targets that are heated to atemperature that causes deformation of the material of the target.However, deformation of the target adversely affects performance andefficiency, and may result in failure.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure and forfurther features and advantages thereof, reference is now made to thefollowing description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a diagram illustrating an example environment in whichelectrons of a target are cooled, according to certain embodiments ofthe present disclosure;

FIG. 2 is a diagram illustrating an example embodiment in which thetarget of FIG. 1 may be a leading edge of a wing of an aerial vehicle,according to certain embodiments of the present disclosure;

FIG. 2A is a diagram illustrating an enlarged detail view of a portionof the example embodiment of FIG. 2, according to certain embodiments ofthe present disclosure;

FIG. 3 is a diagram illustrating an example embodiment in which thetarget of FIG. 1 may be an electrically emissive material, according tocertain embodiments of the present disclosure; and

FIG. 4 is a flow chart illustrating an example method for cooling thetarget of FIG. 1, according to certain embodiments of the presentdisclosure.

DESCRIPTION

Targets may be used in various applications where the target is subjectto intense heat. For example, as a space shuttle enters Earth'satmosphere at a high speed, the temperature of the space shuttle's wingmay increase substantially. As another example, particle acceleratorsmay be used to manufacture medical isotopes. As the beam current of theparticle accelerator on the target feedstock increases, the temperatureof the target feedstock also increases. Once the temperature of thetarget increases to a certain point, the target may deform. Deformationmay include, for example, loss of structural integrity, oxidation,charring, or any other form of deformation. Deformation may reduceefficiency (e.g., increased aerodynamic drag), cause failure of theobject, and increase material costs.

To overcome these and other problems, a target may be cooled by causingthe target to emit electrons, cooling the emitted electrons in a heatsink, and returning the cooled electrons to the target. As a result, thecooled electrons reduce the temperature of the target without resultingin deformation of the target.

Accordingly, aspects of the present disclosure include a method that, inone embodiment, impinges a plurality of particles on a target so thatelectrons are emitted from the target and transports the electrons fromthe target to a heat sink through a transporting medium. The target andthe heat sink may be separated by a distance. The method furtherincludes cooling the electrons using the heat sink and returning theelectrons from the heat sink to the target.

The present disclosure may provide numerous advantages. For example,using electrons to cool the target may provide a large amount of coolingwithout resulting in deformation of the target. Since the target is notdeformed, the efficiency of the application may be increased. As anotherexample, lower cost materials with low or moderate working temperaturesmay be used instead of expensive refractory materials because theheating of the target may occur at the surface of the target due tocollisions with impinging beams or flows of particles. Since the surfaceof the target may be the site of the thermionic emission of electrons,the cooling of the target may occur without transporting heat into thebulk of the target. As a result, cheaper materials with low or moderateworking temperatures may be used. This cooling technique may work eventhough the electrically emissive layer may only be a few molecules thickin embodiments. As another example, material costs may be reducedbecause deformation may be reduced or eliminated. As another example,separating the heat sink and the target by a distance may allow for theelectrons to cool during the transportation of those electrons. Asanother example, since electrons are emitted from the target andreturned to the target in a closed loop, there is not a capacitylimitation because electrons are not depleted. As another example,cooling a target feedstock using electrons may allow for fastermanufacture of medical isotopes because the beam current of a particleaccelerator may be increased without deforming the target feedstock.

Additional details are discussed in FIGS. 1 through 4. FIG. 1illustrates an example environment 100 in which electrons 120 of target110 are cooled. FIGS. 2-2A and 3 show example embodiments in whichtarget 110 of FIG. 1 may be a leading edge of wing 210 of aerial vehicle204 and electrically emissive material 310, respectively. FIG. 4 showsan example method for cooling target 110 of FIG. 1 using electrons.

FIG. 1 is a diagram illustrating an example environment 100 in whichelectrons 120 of target 110 are cooled, according to certain embodimentsof the present disclosure. Environment 100 may include plurality ofparticles 105, target 110, temperature sensor 115, electrons 120,transporting medium 130, heat 135, heat sink 140, temperature sensor145, distance 147, return member 150, valve 155, cooling device 160,coolant 165, processor 170, and network 175. In certain embodiments,plurality of particles 105 may be impinged on target 110, causing thetemperature of target 110 to increase such that target 110 emitselectrons 120. When the temperature of target 110 reaches the thermionicemission point, target 110 may emit electrons 120 exponentially.Electrons 120 may carry heat away from target 110 to heat sink 140through transporting medium 130. Electrons 120 may disburse or rejectheat 135 into transporting medium 130. Heat sink 140 may cool electrons120 and return the cooled electrons 120 to target 110 using returnmember 150. As a result of returning the cooled electrons 120 to target110, the temperature of target 110 may be reduced without deformingtarget 110. Such a cooling technique may provide substantial cooling oftarget 110, increase the efficiency of applications employing thiscooling technique, and decrease material costs. Each component ofenvironment 100 is discussed below.

Plurality of particles 105 may be any beam or flow of particles incertain embodiments. For example, plurality of particles 105 may be air.In that example, the air may be impinged on the leading edge of anaerial vehicle. As another example, plurality of particles 105 may be aplurality of protons. In that example, the plurality of protons may beemitted from a particle accelerator. Plurality of particles 105 may bedirected towards target 110 in certain embodiments. For example, asnoted above, plurality of particles 105 may be air that impinges on theleading edge of an aerial vehicle. As another example, plurality ofparticles 105 may be a plurality of protons emitted from a particleaccelerator towards an electrically emissive material. Plurality ofparticles 105 may cause the temperature of target 110 to increase suchthat target 113 emits electrons 120 in certain embodiments. For example,as an aerial vehicle travels at supersonic or hypersonic speeds, thetemperature of the leading edge of the wing may increase such that theleading edge emits electrons 120. As another example, a particleaccelerator may impinge a plurality of protons on an electricallyemissive material (e.g., to produce a medical isotope, such astechnetium 99 m), thereby increasing the temperature of the electricallyemissive material such that the electrically emissive material emitselectrons 120. When the temperature of target 110 reaches the thermionicemission threshold, the emission of electrons 120 increasesexponentially.

Target 110 may be any object that includes electrons 120 in certainembodiments. For example, target 110 may be the leading edge of anaerial vehicle. As another example, target 110 may be an electricallyemissive material, such as molybdenum or technetium 99 m. Target 110 maybe coupled to temperature sensor 115 and/or return member 150 in certainembodiments. In some embodiments, target 110 may have a cross-sectionalarea less than a cross-sectional area of heat sink 140. Due to pluralityof particles 105 impinging on target 110, the temperature of target 110may increase such that target 110 emits electrons 120 in certainembodiments. For example, where target 110 is the leading edge of anaerial vehicle, the temperature of that leading edge may heat upsignificantly as the aerial vehicle travels at high speeds. As thetemperature of the leading edge increases, the leading edge may emitelectrons 120. When the temperature of the leading edge reaches thethermionic emission threshold of the leading edge, the leading edge mayemit electrons 120 exponentially.

Temperature sensor 115 may be any sensor configured to measure atemperature of target 110 in certain embodiments. For example,temperature sensor 115 may be a thermometer, a thermocouple, or anyother sensor configured to measure the temperature of target 110.Temperature sensor 115 may be coupled to target 110 in any manner insome embodiments. Temperature sensor 115 may be coupled to network 175in any manner (e.g., wired or wireless) in certain embodiments.Temperature sensor 115 may transmit temperature measurements of target110 to processor 170 through network 175. Processor 170 may use thosemeasurements to determine whether to adjust a rate of flow of coolant165 from cooling device 160 to heat sink 140 in some embodiments.Processor 170 may use temperature measurements of target 110 to adjustvalve 155. For example, processor 170 may determine that the temperatureof target 110 is too high and open valve 155 to allow for more coolingelectrons 120 to return to target 110 through return member 150.

Electrons 120 may be any electrons of target 110 in certain embodiments.Electrons 120 may be free electrons in an embodiment. That is, electrons120 may not be bound to other molecules. Electrons 120 may be emittedfrom target 110 as the temperature of target 110 increases. When thetemperature of target 110 reaches the thermionic emission threshold oftarget 110, the emission of electrons 120 increases exponentially. Aselectrons 120 are emitted, each electron carries heat away from target110. In some embodiments, electrons 120 may travel from target 110 toheat sink 140 through transporting medium 130. Electrons 120 may becooled in heat sink 140 in certain embodiments. Electrons 120 may alsobe cooled during transportation through transporting medium 130. Forexample, electrons 120 may reject heat 135 into transporting medium 130.After electrons 120 are cooled in heat sink 140, the cooled electrons120 may be returned to target 110 through return member 150 in a closedloop (i.e., recirculated). Although electrons 120 are discussedthroughout this disclosure, other particles may be used to cool target110. For example, any type of fermion may be used. As another example,muons may be used.

Transporting medium 130 may be any medium capable of transportingelectrons 120 in certain embodiments. For example, transporting medium130 may be air. As another example, transporting medium 130 may be avacuum. As another example, transporting medium 130 may include aconductive medium of ionized plasma. In that example, the conductivemedium of ionized plasma may be formed as a shockwave travels off of thefront of an aerial vehicle. During the transportation of electrons 120through transporting medium 130, electrons 120 may be cooled. Forexample, electrons 120 may disburse or reject heat 135 into transportingmedium 130. Transporting medium 130 may transport electrons 120 fromtarget 110 to heat sink 140.

Heat 135 may be any heat of electrons 120 that may be disbursed, orrejected into transporting medium 130 as electrons 120 are transportedfrom target 110 to heat sink 140 in an embodiment. Heat 135 may bedisbursed or rejected via radiation or conduction (e.g., conductivecollisions) in an embodiment.

Heat sink 140 may be any device configured to capture and cool electrons120. For example, heat sink 140 may be a structure with a plurality offins extending vertically from a base. Heat sink 140 may be any type ofheat sink, such as a pin heat sink, a straight heat sink, or a flaredheat sink. Heat sink 140 may be a radiator in an embodiment. Heat sink140 may capture emitted electrons 120 from transporting medium 130 insome embodiments. For example, heat sink 140 may be positively chargedsuch that the emitted electrons 120, which are negatively charged, areattracted to heat sink 140, in some embodiments, heat sink 140 may coolelectrons 120 by dissipating heat into a surrounding area. Heat sink 140may be separated from target 110 by distance 147, which may allowelectrons 120 to cool in transporting medium 130 prior to being cooledin heat sink 140. Heat sink 140 may be coupled to temperature sensor 145and/or return member 150 in any manner in certain embodiments. Heat sink140 may also be in fluid communication with cooling device 160. Forexample, heat sink 140 may receive coolant 155 from cooling device 160.As explained below, coolant 165 may cool heat sink 140 as itstemperature increases due to receiving electrons 120 from target 110. Incertain embodiments, heat sink 140 may have a cross-sectional area thatis greater than a cross-sectional area of target 110. For example, aratio of a cross-sectional area of heat sink 140 to a cross-sectionalarea of target 110 may be greater than one. Generally, providing a ratioof a cross-sectional area of heat sink 140 to a cross-sectional area oftarget 110 greater than one may provide for greater heat transfer fromtarget 110 to heat sink 140.

Temperature sensor 145 may be any sensor configured to measure atemperature of heat sink 140 in certain embodiments. For example,temperature sensor 145 may be a thermometer, a thermocouple, or anyother sensor configured to measure the temperature of heat sink 140.Temperature sensor 145 may be coupled to heat sink 140 in any manner insome embodiments. Temperature sensor 145 may be coupled to network 175in any manner (e.g., wired or wireless) in certain embodiments.Temperature sensor 145 may transmit temperature measurements of heatsink 140 to processor 170 through network 175. Processor 170 may usethose measurements to adjust a rate of flow of coolant 165 from coolingdevice 160 to heat sink 140 in some embodiments.

Distance 147 may be any distance that separates target 110 from heatsink 140 in certain embodiments. For example, distance 147 may be thedistance between a leading edge of an aircraft and a rear portion of theaircraft where heat sink 140 may be positioned in some embodiments. Asanother example, distance 147 may be any non-zero distance such thattarget 110 and heat sink 140 are not adjacent. Separating heat sink 140and target 110 using distance 147 may allow electrons 120 to cool intransporting medium 130. Distance 147 may be any distance. For example,distance 147 may be six inches. As another example, distance 147 may besix feet.

Return member 150 may be any device configured to transport electrons120 in certain embodiments. Return member 150 transports cooledelectrons 120 from heat sink 140 to target 110 such that cooledelectrons 120 are returned to target 110 in an embodiment. Return member150 may be a wire in some embodiments. Return member 150 may be coupledto heat sink 140 and/or target 110 in an embodiment. Return member 150may include valve 155 in an embodiment.

Valve 155 may be any type of controllable valve in an embodiment. Forexample, valve 155 may be a silicone control rectifier. As anotherexample, valve 155 may be a field effect transistor. Valve 155 may becoupled to return member 150 in an embodiment. Valve 155 may be coupledto processor 170 via network 175 in an embodiment. Valve 155, throughsignals received from processor 170 via network 175, may control theflow of electrons 120 through return member 150 in an embodiment. Forexample, valve 155 may receive signals from processor 170 via network175 instructing valve 155 to open or close (partially or fully). As thetemperature of target 110 increases to a certain range or point, asdiscussed below, valve 155 may receive a signal from processor 170 vianetwork 175 instructing valve 155 to increase its opening to allow morecooling electrons 120 through return member 150. Allowing more coolingelectrons 120 to return to target 110 may decrease the temperature oftarget 110. As the temperature of target 110 decreases to a certainrange or point, valve 155 may receive a signal from processor 170 vianetwork 175 instructing valve 155 to decrease its opening to allow fewercooling electrons 120 through return member 150. Allowing fewer coolingelectrons 120 to return to target 110 may increase the temperature oftarget 110. By controlling the flow of electrons 120, valve 155 (viasignals received from processor 170) may control the temperature oftarget 110 so that target 110 maintains a constant temperature below themaximum working temperature of target 110. Maintaining such atemperature may prevent target 110 from deforming.

Cooling device 160 may be any device configured to cool heat sink 140 incertain embodiments. For example, cooling device 160 may be a pump thatpumps coolant 165 through heat sink 140. Cooling device 160 may be influid communication with heat sink 140. For example, cooling device 160may apply coolant 165 to heat sink 140. In that example, cooling device160 may receive coolant 165 back from heat sink 140. Cooling device 160may be coupled to network 175 in an embodiment. Cooling device 160 maybe controlled by processor 170 through network 175 in some embodiments.For example, cooling device 160 may receive a signal from processor 170through network 175 directing cooling device 160 to change a rate offluid flow of coolant 165 into heat sink 140. In that example, coolingdevice 160 may be instructed to change a rate of flow of coolant 165based on temperature readings from temperature sensor 115 and/ortemperature sensor 145.

Coolant 165 may be any fluid or gas used to cool heat, sink 140 in anembodiment. For example, coolant 165 may be water. As another example,coolant 165 may be a refrigerant. As another example, coolant 165 may befuel. Coolant 165 may be transported from cooling device 160 to heatsink 140 and returned from heat sink 140 to cooling device 160 incertain embodiments. As a result of coolant 165 being applied to heatsink 140, coolant 165 may carry heat away from heat sink 140 therebycooling heat sink 140.

Processor 170 may control the operation of temperature sensor 115,temperature sensor 145, valve 155, and/or cooling device 160 byprocessing data received through network 175 and sending signals throughnetwork 175 in certain embodiments. Processor 170 may control theoperation of particle accelerator 304 (discussed below) in someembodiments. Processor 170 may receive temperature measurements fromtemperature sensor 115 and/or temperature sensor 145 either directly orthrough network 175 in certain embodiments. Based on the temperaturemeasurements from temperature sensor 115 and/or temperature sensor 145,processor 170 may determine whether to adjust a rate of flow of coolant165 from cooling device 160 to heat sink 140 in an embodiment. Forexample, as the temperature measurement from temperature sensor 145increases, processor 170 may determine to increase a rate of coolant165.

Processor 170 may regulate the temperature of target 110 by controllingthe flow of electrons 120 through valve 155 in an embodiment. Forexample, processor 170 may adjust the opening or closing of valve 155based on temperature measurements from temperature sensor 115 indicatingthe temperature of target 110. As the temperature measurements of target110 increase, processor 170 may send a signal to valve 155 via network175 instructing valve 155 to increase its opening to allow more coolingelectrons 120 to return to target 110. As the temperature measurementsof target 110 decrease, processor 170 may send a signal to valve 155 vianetwork 175 instructing valve 155 to decrease its opening to allow fewercooling electrons 120 to return to target 110. Processor 170 maydetermine those adjustments in any manner. For example, processor 170may compare the temperature measurements of target 110 to a thresholdvalue and adjust valve 155 if the measurements are within a certainpercentage of the threshold value (e.g., 10%, 20%, 30%, or any otherpercentage). By controlling valve 155, processor 170 may control thetemperature of target 110 so that the temperature remains constant.Additionally, controlling valve 155 may allow processor 170 to maintainthe temperature of target 110 below the maximum working temperature oftarget 110, which may prevent target 110 from deforming. Controllingvalve 155 may also allow processor 170 to prevent the temperature oftarget 110 from dropping too much. For example, processor 170 maydecrease the flow of electrons 120 to prevent the temperature of target110 from dropping to a temperature range where the material of target110 may crack.

Processor 170 includes any hardware and/or software that operates tocontrol and process information. For example, processor 170 may executelogic to control the operation of cooling device 160 and/or particleaccelerator 304. Processor 170 may be a programmable logic device, amicrocontroller, a microprocessor, any suitable processing device, orany suitable combination of the preceding.

Network 175 may be any suitable network operable to facilitatecommunication between temperature sensor 115, temperature sensor 145,valve 155, cooling device 160, and processor 170. In some embodiments,network 175 may be operable to facilitate communication between particleaccelerator 304 and processor 170. Network 175 may include anyinterconnecting system capable of lly emissive material 310 may be anytype of electride n an embodiment. As another example, electrically emisall or a portion of a public or private data network, a local areanetwork (LAN), a metropolitan area network (MAN), a wide area network(WAN), a local, regional, or global communication or computer network,such as the Internet, a wireline or wireless network, an enterpriseintranet, or any other suitable communication link, includingcombinations thereof, operable to facilitate communication betweentemperature sensor 115, temperature sensor 145, valve 155, coolingdevice 160, processor 170, and/or particle accelerator 304.

As an example embodiment of operation, plurality of particles 105 may beimpinged on target 110. As the temperature of target 110 increases,target 110 emits electrons 120. Electrons 120 may be transported fromtarget 110 to heat sink 140 through transporting medium 130. Heat sink140 may cool electrons 120 and return cooled electrons 120 to target 110using return member 150. As the cooled electrons 120 are returned totarget 110, the temperature of target 110 may decrease.

Example embodiments that may implement the components of FIG. 1 aredescribed below with respect to FIGS. 2-2A and FIG. 3. In particular,FIG. 2 illustrates an example embodiment where target 110 of FIG. 1 maybe leading edge of wing 210 on aerial vehicle 204, FIG. 2A illustratesan enlarged detail view of a portion of aerial vehicle 204, and FIG. 3illustrates an example embodiment where target 110 of FIG. 1 may beelectrically emissive material 310. Although FIGS. 2-2A and FIG. 3illustrate many components from FIG. 1, those components will not bediscussed again with respect to FIGS. 2-2A and FIG. 3.

FIG. 2 is a diagram illustrating an example embodiment in which target110 of FIG. 1 may be leading edge of wing 210 of aerial vehicle 204,according to certain embodiments of the present disclosure. In thisexample embodiment, target 110 of FIG. 1 may be leading edge of wing 210and plurality of particles 105 may be air 205.

Aerial vehicle 204 may be any vehicle configured to travel through air205 in an embodiment. For example, aerial vehicle 204 may be a scramjet. As another example, aerial vehicle 204 may be a jet. As anotherexample, aerial vehicle 204 may be a space vehicle, such as a spaceshuttle. Aerial vehicle 204 may include heat sink 140 separated from aleading edge of wing 210 by distance 147. For example, heat sink 140 maybe positioned towards the rear of aerial vehicle 204. As anotherexample, heat sink 140 may be positioned at the rear of a wing of aerialvehicle 204. In that manner, as aerial vehicle 204 travels through air205, air 205 forces electrons 120 emitted from leading edge of wing 210towards heat sink 140 in the rear of aerial vehicle 204.

Air 205 may be any portion of an atmosphere in an embodiment. Forexample, air 205 may be a portion of Earth's atmosphere. Air 205 may beimpinged on leading edge of wing 210 thereby causing the temperature ofleading edge of wing 210 to increase.

Leading edge of wing 210 may be a portion of a wing of aerial vehicle204 that is the foremost edge of the wing in an embodiment. Leading edgeof wing 210 may include electrons 120. Leading edge of wing 210 may beany shape. For example, leading edge of wing 210 may be straight. Asanother example, leading edge of wing 210 may be curved. Leading edge ofwing 210 may be swept in some embodiments. Leading edge of wing 210 maybe unswept in certain embodiments. Leading edge of wing 210 may be madeof any material. For example, leading edge of wing 210 may be made ofaluminum. As leading edge of wing 210 is impinged with air 205, thetemperature of leading edge of wing 210 may increase such that leadingedge of wing 210 emits electrons 120. As noted above, when thetemperature of leading edge of wing 210 reaches the thermionic emissionpoint of leading edge of wing 210, the emission of electrons 120increases exponentially.

As an example embodiment of operation, aerial vehicle 204 may betravelling at extremely high speeds through air 205. For example, aerialvehicle 204 may travel at Mach 5 speed. As another example, aerialvehicle 204 may travel at Mach 6 speed. As air 205 impinges on leadingedge of wing 210, the temperature of leading edge of wing 210 increases.The temperature of leading edge of wing 210 may increase such thatelectrons 120 are emitted from leading edge of wing 210. Electrons 120each carry away heat 135 from leading edge of wing 210. Since aerialvehicle 204 may be travelling at high speeds through air 205, air 205pushes the emitted electrons 120 from leading edge of wing 210 to heatsink 140 positioned behind leading edge of wing 210. Heat sink 140captures the emitted electrons 120. Heat sink 140 cools electrons 120and returns the cooled electrons 120 back to leading edge of wing 210through return member 150. As a result of returning cooled electrons 120to leading edge of wing 210, leading edge of wing 210 may be cooled.Cooling leading edge of wing 210 by cooling electrons 120 emitted fromleading edge of wing 210 provides significant cooling capability withoutdeforming leading edge of wing 210.

FIG. 3 is a diagram illustrating an example embodiment in which target110 of FIG. 1 may be electrically emissive material 310, according tocertain embodiments of the present disclosure. In this exampleembodiment, plurality of particles 105 may be a plurality of protons 305and target 110 may be electrically emissive material 310. As describedbelow, particle accelerator 304 may emit plurality of protons 305, whichare impinged on electrically emissive material 310. As electricallyemissive material 310 increases in temperature, electrically emissivematerial 310 may emit electrons 120, which travel across vacuum 325 toheat sink 140 through electric field 330. Heat sink 140 may coolelectrons 120 and return the cooled electrons to electrically emissivematerial 310.

Particle accelerator 304 may be any device configured to impinge protons305 on electrically emissive material 310. For example, particleaccelerator 304 may be a cyclotron. Particle accelerator 304 may becoupled to processor 170 through network 175 in an embodiment. In someembodiments, processor 170 may transmit a signal to particle accelerator304 through network 175 to adjust the beam current of particleaccelerator 304.

Plurality of protons 305 may be any beam of protons in an embodiment.Protons 305 may be emitted from particle accelerator 304 in anembodiment. Protons 305 may impinge on electrically emissive material310 in an embodiment. As a result of that impingement, electricallyemissive material 310 may increase in temperature.

Electrically emissive material 310 may be any type of chemically inertmaterial that is not subject to oxidation in an embodiment. For example,electrically emissive material 310 may include molybdenum. As anotherexample, electrically emissive material 310 may be a mayenite electride(calcium aluminate). Electrically emissive material 310 may be any typeof electride in an embodiment. As another example, electrically emissivematerial 310 may be the target feedstock for a medical isotope. Asanother example, electrically emissive material 310 may be a ceramicelectride. As another example, electrically emissive material 310 may bealuminum. Electrically emissive material 310 may include electrons 120in an embodiment. As the temperature of electrically emissive material310 increases, electrically emissive material 310 may emit electrons120. When the temperature of electrically emissive material 310 reachesthe thermionic emission threshold, electrically emissive material 310may emit electrons 120 exponentially.

Vacuum 325 may be any space where the pressure is lower than atmosphericpressure. For example, vacuum 325 may be a space that is devoid ofmatter. As another example, vacuum 325 may be a partial vacuum. Vacuum325 may include electric field 330 in certain embodiments. For example,electric field 330 may pull electrons 120 through vacuum 325 fromelectrically emissive material 310 to heat sink 140.

Electric field 330 may be any component of an electromagnetic field inan embodiment. Electric field 330 may facilitate the transportation ofemitted electrons 120 to heat sink 140 through vacuum 325 in anembodiment. Electric field 330 may arise artificially or naturally. Forexample, electric field 330 may be artificially created by applying avoltage potential between electrically emissive material 310 and heatsink 140. As another example, electric field 330 may arise naturally asa result of differences in charge between the point where electrons 120are emitted (i.e., target 110) and the point where electrons 120 arecollected (i.e., heat sink 140).

As an example embodiment of operation, particle accelerator 304 mayimpinge protons 305 on electrically emissive material 310, causing thetemperature of electrically emissive material 310 to increase. Thetemperature of electrically emissive material 310 may increase such thatelectrically emissive material 310 emits electrons 120. Electrons 120may carry heat away from electrically emissive material 310. Electrons120 may be pulled towards heat sink 140 through vacuum 325 usingelectric field 330. Heat sink 140 may capture electrons 120 and coolelectrons 120. Heat sink 140 may return the cooled electrons 120 toelectrically emissive material 310 using return member 150. Returningthe cooled electrons 120 to electrically emissive material 310 maydecrease the temperature of electrically emissive material 310.Accordingly, returning the cooled electrons 120 provides significantcooling of electrically emissive material 310 without deformingelectrically emissive material 310.

FIG. 4 is a flow chart illustrating an example method 400 for coolingtarget 110 of FIG. 1, according to certain embodiments of the presentdisclosure. Method 400 begins at step 410, where plurality of particles105 may be impinged on target 110 such that electrons 120 are emittedfrom target 110. For example, plurality of particles 105 may be air 205that is impinged on leading edge of wing 210 of aerial vehicle 204. Asanother example, plurality of particles 105 may be protons 305 emittedfrom particle accelerator 304 and impinged on electrically emissivematerial 310.

At step 420, electrons 120 may be transported from target 110 to heatsink 140. For example, electrons 120 may be emitted from leading edge ofwing 210 and transported to heat sink 140 through transporting medium130. As another example, electrons 120 may be emitted from electricallyemissive material 310 and transported from electrically emissivematerial 310 to heat sink 140 through electric field 330 of vacuum 325.In some embodiments, target 110 and heat sink 140 may be separated bydistance 147.

At step 430, electrons 120 may be cooled using heat sink 140. As notedabove, electrons 120 may carry heat away from target 110. As electrons120 are passed through heat sink 140, electrons 120 may be cooled.

At step 440, electrons 120 may be returned from heat sink 140 to target110. For example, cooled electrons 120 may be returned from heat sink140 to leading edge of wing 210 of aerial vehicle 204. As anotherexample, cooled electrons 120 may be returned from heat sink 140 toelectrically emissive material 310. In some embodiments, cooledelectrons 120 are returned from heat sink 140 to target 110 using returnmember 150.

As an example embodiment of operation, plurality of particles 105 may beimpinged on target 110, causing the temperature of target 110 toincrease. The temperature of target 110 may increase such that target110 emits electrons 120. Electrons 120 may carry heat away from target110. Electrons 120 may be transported across transporting medium 130 toheat sink 140, where electrons 120 are cooled. The cooled electrons 120are returned to target 110 using return member 150. Returning cooledelectrons 120 to target 110 decreases the temperature of target 110without deforming target 110.

The present disclosure may provide numerous advantages. For example,using electrons 120 to cool target 110 may provide a large amount ofcooling without resulting in deformation of target 110. As anotherexample, since deformation is reduced or eliminated, material costs maybe reduced. As another example, separating target 110 and heat sink 140by distance 147 may allow for electrons 120 to cool during thetransportation of electrons 120. As another example, since electrons 120are emitted from target 110 and returned to target 110, there is not acapacity limitation because electrons 120 are never depleted. As anotherexample, cooling electrically emissive material 310 using electrons 120may allow for faster manufacture of medical isotopes because the beamcurrent of particle accelerator 304 may be increased without deformingelectrically emissive material 310.

Although the present disclosure has been described with severalembodiments, a myriad of changes, variations, alterations,transformations, and modifications may be suggested to one skilled inthe art, and it is intended that the present disclosure encompass suchchanges, variations, alterations, transformations, and modifications asfall within the scope of the appended claims.

What is claimed is:
 1. A system, comprising: a heat sink configured tocool electrons, the electrons being emitted from a target in response toan impingement of a plurality of particles on the target, wherein theheat sink and the target are separated by a distance; a return memberconfigured to return the electrons from the heat sink to the target, thereturn member configured to couple to the heat sink and the target; afirst temperature sensor configured to measure a temperature of thetarget; and a processor configured to receive the temperature of thetarget through the first temperature sensor and to control flow of theelectrons from the heat sink back to the target based at least in parton the received temperature.
 2. The system of claim 1, wherein thetarget comprises a leading edge of a wing of an aerial vehicle.
 3. Thesystem of claim 1, wherein the target comprises an electrically emissivematerial.
 4. The system of claim 1, wherein a ratio of a cross-sectionalarea of the heat sink to a cross-sectional area of the target is greaterthan one.
 5. The system of claim 1, further comprising a cooling deviceconfigured to cool the heat sink using a coolant.
 6. The system of claim5, further comprising: a first temperature sensor configured to measurea first temperature of the heat sink; a second temperature sensorconfigured to measure a second temperature of the target; and aprocessor configured to determine whether to adjust a rate of flow ofthe coolant from the cooling device to the heat sink based on the firsttemperature and the second temperature.
 7. A system, comprising: a heatsink configured to cool electrons, the electrons being emitted from aleading edge of a wing of an aerial vehicle in response to animpingement of air on the leading edge of the wing, wherein the heatsink is separated from the leading edge of the wing by a distance; areturn member configured to return the electrons from the heat sink tothe leading edge of the wing, the return member configured to couple tothe heat sink and the leading edge of the wing; a first temperaturesensor configured to measure a temperature of the leading edge; and aprocessor configured to receive the temperature of the leading edgethrough the first temperature sensor and to control flow of theelectrons from the heat sink back to the leading edge based at least inpart on the received temperature.
 8. The system of claim 7, wherein thereturn member comprises a wired connection.
 9. The system of claim 7,wherein a ratio of a cross-sectional area of the heat sink to across-sectional area of the leading edge of the wing is greater thanone.